Founded in 2018, the company is a high-tech enterprise specializing in the R&D, manufacturing and sales of semiconductor equipment, driving the upgrading of the global semiconductor industry through technological innovation. Located at No. 58 Meiyan West Road, Pingwang Town, Wujiang District, Suzhou City, the company is situated in the core area of the Yangtze River Delta semiconductor industry cluster. It covers an area of 37 mu with a building area of 11,331 square meters, providing solid support for production and R&D.
The company has a technical team of more than 90 members, led by doctors and senior industry experts, offering core intellectual support for technological breakthroughs. It has achieved fruitful R&D results, with a total of 24 invention patents, 42 utility model patents and 6 software copyrights applied for. These patented technologies have strengthened the core competitiveness of its products.
With its comprehensive strength, the company has been awarded many honors including Suzhou Gazelle Enterprise and Jiangsu Province Specialized, Sophisticated, Unique and New Enterprise, establishing itself as an industry benchmark.
Its customers cover all segments of the semiconductor industry chain, including substrate manufacturers, FABs and national laboratories, serving more than 100 enterprises and winning wide trust. In October 2024, the company realized the overseas export of full-line equipment including lapping, polishing and cleaning machines. As of November 2025, a total of 568 sets of various semiconductor equipment had been delivered, marking remarkable achievements in its global layout.
In the future, the company will uphold the philosophy of “Empowering the Industry with Technology”, provide full-generational semiconductor material solutions, and support industrial innovation and independent control.
Founded in August 2021, the company is a high-end technical service provider specializing in customized back-end dicing, grinding and polishing processing for 1st to 4th-generation semiconductor materials. Focusing on core processes in semiconductor material processing, it delivers professional solutions to customers with strong technical capabilities.
The company has assembled a team of senior industry experts and is equipped with internationally advanced cutting, lapping, polishing, cleaning and testing equipment, establishing a full-chain service system covering customized processing, material characterization and ready-to-use substrates. With profound technical expertise, the company has established long-term and stable strategic cooperative relationships with many leading domestic semiconductor material enterprises.
In core process development, the company has successfully developed a high-speed diamond wire cutting process for silicon carbide (SiC) and gallium nitride (GaN) crystal materials. Compared with traditional slurry wire cutting, this process significantly shortens cutting time while precisely maintaining excellent surface profile specifications. Supported by highly efficient and coordinated grinding, polishing and cleaning processes, the company achieves 24-hour rapid delivery of dicing, grinding and polishing for 6/8-inch silicon carbide substrates, strongly supporting customers in seizing market opportunities.
Adhering to the development philosophy of “Technology First, Innovation-Driven”, the company is committed to becoming a comprehensive professional semiconductor technology enterprise integrating semiconductor material processing, testing and analysis, process solution design, and full-line equipment R&D and delivery (including complete processes and data), contributing core strength to the development of the global semiconductor industry.
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