Core technology of “mechanical brushing + chemical solution synergy” provides dual guarantees for the efficient removal of contaminants on the wafer surface, fundamentally ensuring the quality stability and performance reliability of wafers.
· Modular design for flexible configuration;
· Customized multi-tank structure to improve efficiency;
· Compatible with acidic solution cleaning / alkaline solution cleaning;
· Advanced particle and metal contamination control technology;
· Advanced atomization cleaning technology for non-destructive cleaning;
· High reliability, safety, and low maintenance cost;
· Integrated high-performance cleaning and drying technology.
Product Performance
| Specification/Model | 12-inch Single Wafer Cleaning Machine |
| Wafer size | 12" Wafer Process |
| Function | Wafer Cleaning |
| Particle Remove Rate | ≤ 30ea/wafer (size≥0.3μm) |
| Metal ion Content | 1E10 atom/cm |
| Chamber Count | 6, 8 (Brush Cleaning Chamber + Spin Dry Chamber) |
| Wafer Breakage | 1/100000 |
| Equipment Dependent Uptime (%; Average) | ≥95 |
| Mean Time Between Failure (MTBF/Hours) | ≥500 |
| UPH | Single-side≥260 pcs、Flip-side≥170 pcs |
| Equipment Dimensions | 3100 mm (W) × 2560 mm (D) × 3000 mm (H) |
Application Fields
Silicon