In the booming third-generation semiconductor sector, silicon carbide (SiC) and gallium nitride (GaN) are becoming the core foundations for electric vehicles, 5G communications and new energy applications. However, their ultra-high hardness and brittleness bring severe challenges to crystal cutting—a "pain point" that has plagued the industry. Traditional cutting methods suffer from low efficiency, high material loss and deep surface damage, which have become key bottlenecks restricting cost reduction and capacity expansion.

How to achieve efficient and precision cutting of high-hardness crystals while maximizing the conservation of valuable materials? Our dedicated solution for high-speed diamond wire cutting is precisely tailored to solve this problem.

Our core breakthroughs lie in:

Extreme efficiency, a revolution in speed：With self-developed diamond wire technology and dynamic process control systems optimized for SiC and GaN crystal properties, we achieve a significant leap in cutting speed, supporting rapid capacity release.
Precision cutting loss, value retention：Ultra-fine diamond wire combined with a stable cutting system minimizes kerf loss, directly increasing the yield of each crystal ingot and maximizing the utilization of every valuable wafer.

Surface optimization, damage control：The process delivers superior surface quality, reducing the burden of subsequent lapping and polishing as well as the risk of micro-cracks, laying a solid foundation for reliable device performance.

More than a single-point technology, we provide you with mature process verification:

We offer closed-loop services ranging from cutting process development and parameter optimization to full-process testing. Through rigorous comparative data and wafer analysis, we ensure the solution can be directly and stably transferred to your production line, greatly shortening the process verification cycle and quickly realizing return on investment.

Only by breaking the constraints of materials can we unleash the full potential of performance. We sincerely invite you to experience the efficiency revolution brought by diamond wire rapid cutting technology, and join us in advancing the third-generation semiconductor industry with greater agility and forging future competitiveness.