Amid the rapid iteration of semiconductor materials, a huge gap exists between perfect laboratory samples and stable, efficient mass production—covering from silicon carbide substrates to composite substrates. This gap is the risk of process scaling. The traditional R&D model often exposes layers of problems in yield, efficiency and cost only after massive investment in production lines.

How to safely and efficiently make the critical leap from "lab success" to "mass production success"? Our fully established integrated pilot production line for semiconductor dicing, grinding and polishing is precisely your "mass production outpost" and "process verification center".

This is not just a small-scale production line, but a complete solution:

Full-process closed-loop verification：We provide a complete pilot platform covering cutting, grinding and polishing, which truly simulates the mass production environment. Your new materials and processes can complete full-chain testing here, exposing and solving connection problems in each link in advance, avoiding huge risks after tens of millions of investment in production lines.

Data-driven process window locking：In the pilot stage, we help you systematically explore and optimize key parameters (such as cutting wire speed, grinding pressure, polishing slurry formula, etc.). Through detailed data analysis, we lock the optimal process window and provide a solid and reliable process package for mass production.

Accurate prediction of cost and efficiency：Through continuous operation of the pilot line, the actual material consumption, working hour cost and comprehensive output efficiency after mass production can be accurately calculated, making your investment decisions and cost control well-founded.

We are committed to building the pilot production line into an "accelerator" and a "fuse" for industrialization. We sincerely invite chip manufacturers, substrate enterprises and advanced material R&D institutions to cooperate with us, so that we can jointly transform cutting-edge technologies into market competitiveness faster and more steadily.