Product Performance
| Specification/Model | 12-inch RCA single-wafer cleaning integrated machine |
| Wafer size | 12"wafer process |
| Function | Wafer cleaning |
| Particle Remove Rate | ≤30ea/wafer (size≥0.3μm) |
| Metal ion Content | ≤5E10 atom/cm |
| Wafer Breakage | 1/100000 |
| Equipment Dependent Uptime (%; Average) | ≥95 |
| Mean Time Between Failure (MTBF/Hours） | ≥500 |
| UPH | ≥50pcs |
| Equipment Dimensions | 2500mm(W)*4700mm(L)*2400mm(H) |
Application Fields
Silicon Carbide, Silicon, Sapphire