| Specification/Model | Single-wafer ultrasonic cleaning integrated machine |
| Wafer size | 4"6"8"wafer |
| Function | Wafer cleaning |
| Particle Remove Rate | ≤100ea/wafer (size0.3~0.5μm) |
| Metal ion Content | 5E10 atom/cm |
| Wafer Breakage | 1/100000 |
| Equipment Dependent Uptime (%;Average) | ≥95 |
| Mean Time Between Failure (MTBF/Hours） | ≥500 |
| UPH | 20Pcs |
| Equipment Dimensions | 3700mm（W）*2500mm（L）*2200mm（H） |
Application Fields
Silicon, Sapphire, Silicon Carbide