| Specification/Model | 12-inch single-wafer thinning machine |
| Wafer Size | 8"~12"wafer process |
| Function | Wafer Grinder |
| chuck table | 3 |
| Air Spindle (Wheel) | 2 |
| Grinding Method | In-feed grindingwith wafer rotation |
| Thickness Gauge | Real time Gauge (NCG Option) |
| Wheel spindle | 12kw/4000RPM Max |
| Grinding Wheel | Φ366mm |
| Roughness | Specified grinding wheel＜5nm |
| GBIR | SiC＜2um、Si＜0.6um |
| UPH | >95% |
| Equipment Dimensions | 1590mm（W）*3400mm（L）*1800mm（H） |
Application Fields
Silicon, Silicon Carbide