| Specification/Model | Fully Automatic Wafer Thickness Measuring and Sorting Machine |
| Wafer size | 4"6"8"wafer |
| Function | Wafer surface geometric parameter measurement |
| Detection Range（um） | 40~2000 |
| Repeatability | 3 σ≤1 .0 μm |
| Equipment Dimensions（um） | 0.15(Vertical static measurement resolution) |
| Wafer Breakage | 1/100000 |
| Equipment Dependent Uptime (%; Average) | ≥98 |
| Mean Time Between Failure (MTBF/Hours） | ≥600 |
| UPH | (Cross) ≥ 200 Pcs, (Meter-shaped pattern) ≥ 150 Pcs, 2 mm pitch map ≥ 5 Pcs |
| Equipment Dimensions | 1600mm（W）*2000mm（L）*2000mm（H） |
Application Fields
Silicon wafers, Silicon Carbide (SiC), Sapphire, Compound semiconductors