· Pneumatic cylinder pressure application, independent motor drive with variable frequency control, enabling precise control of speed and pressure.
· Infrared temperature sensing and automatic control system for the polishing platen.
· Automatic positioning function for ceramic platens, and automatic cleaning system for polishing pads.
· Precise control of platen and process temperature via large cooling system and PID algorithm.
· Polishing slurry cooling and circulation system with automatic reflux, stirring and filtration.
· Visualized management and control system for flow rate, temperature and pressure.
Product Performance
| Specification/Model | 50-inch single-sided CMP polishing machine | 60-inch single-sided CMP polishing machine |
| Platen Size | O.DØ1276× I.DØ315 | O.DØ1500× I.DØ330 |
| Platen Material | SUS 410 | SUS 410 |
| Ceramic Platen Specification | 485mm | 576mm |
| Platen Rotation Speed | 70rpm | 70rpm |
| 4-Axis Pressure Plate Rotation Speed | 60rpm | 60rpm |
| Slurry Supply | Independent liquid supply | Independent liquid supply |
| Machine Dimensions | 1,630(W) ×2,500(L) ×2,700(H) | 1,800(W) ×2,800(L) ×3,000(H) |
| Machine Power Supply | AC380V, 3P, 50/60Hz | AC380V, 3P, 50/60Hz |
Application Fields
Polishing for 4", 6", 8" silicon wafers, sapphire and compound semiconductor substrates.