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  • ·Substrate Epitaxial End
  • ·FAB Advanced Packaging End
COMPANY PROFILE

Yangfan Semiconductor Technology (Suzhou) Co., Ltd

Yangfan Semiconductor (Jiangsu) Co., Ltd. has an equipment subsidiary founded in 2018, a high-tech enterprise specializing in the R&D, manufacturing and sales of semiconductor equipment, driving the upgrading of the global semiconductor industry through technological innovation. Located at No. 58 Meiyan West Road, Pingwang Town, Wujiang District, Suzhou City, the company lies in the core area of the Yangtze River Delta semiconductor industry cluster. It covers an area of 37 mu with a building area of 11,331 square meters, providing solid support for production and R&D.


The company has a technical team of more than 90 members, led by doctors and senior industry experts, offering core intellectual support for technological breakthroughs. It has achieved fruitful R&D results, with a total of 24 invention patents, 42 utility model patents and 6 software copyrights applied for. These patented technologies have strengthened the core competitiveness of its products. With its comprehensive strength, the company has been awarded many honors including Suzhou Gazelle Enterprise and Jiangsu Province Specialized, Sophisticated, Unique and New Enterprise, establishing itself as an industry benchmark.


Its customers cover all segments of the semiconductor industry chain, including substrate manufacturers, FABs and national laboratories, serving more than 100 enterprises and winning wide trust. In October 2024, the company realized the overseas export of full-line equipment including lapping, polishing and cleaning machines. As of November 2025, a total of 568 sets of various semiconductor equipment had been delivered, marking remarkable achievements in its global layout. In the future, the company will uphold the philosophy of "Empowering the Industry with Technology", provide full-generational semiconductor material solutions, and support industrial innovation and independent control.

Founded in August 2021, the company is a high-end technical service provider specializing in customized back-end dicing, grinding and polishing processing for 1st to 4th-generation semiconductor materials. Focusing on the core links in the field of semiconductor material processing, it provides customers with professional solutions based on strong technical strength.

The company has assembled a team of industry senior experts and is equipped with internationally advanced cutting, lapping, polishing, cleaning and testing equipment, establishing a full-chain service system covering customized processing, material characterization and ready-to-use substrates. With profound technical accumulation, the company has established long-term and stable strategic cooperative relationships with many leading domestic semiconductor material enterprises.

11331+

Floor Area(㎡)

90+

Technical team (person)

24+

Number of invention patents (pieces)

42+

Utility model patent (unit)

6+

Software copyright patents (number)

100+

Serve customers (or families)
TECHNOLOGICAL INNOVATION

TECHNOLOGICAL

Semiconductor Material Dicing, Grinding and Polishing Pilot …
Epitaxial Wafer Regeneration Foundry Service
Diamond Wire Rapid Cutting Technology for Silicon Carbide & …
Special R&D & Experimental Line for Cleaning Equipment
Semiconductor Material Dicing, Grinding and Polishing Pilot Production Line

Semiconductor Material Dicing, Grinding and Polishing Pilot …

The semiconductor material dicing, grinding and polishing pilot production line built by the company can provide an integrated service of whole-line equipment supply + full-process process technology delivery.From production line planning, equipment selection to process parameter debugging and mass production technical guidance, we provide customized solutions for customers, helping them quickly complete the technology ramp-up of newly built dicing, grinding and polishing lines and realize large-scale mass production.
Epitaxial Wafer Regeneration Foundry Service

Epitaxial Wafer Regeneration Foundry Service

To address the industry pain point of failed homoepitaxy on silicon carbide (SiC) substrates, the company has specially launched an epitaxial wafer regeneration foundry service. Through professional processes to remove the failed epitaxial layer, followed by high-precision grinding and polishing, the finished silicon carbide substrate is delivered to customers. This helps customers significantly reduce investment costs in the epitaxy process and achieve efficient resource reuse.
Diamond Wire Rapid Cutting Technology for Silicon Carbide & Gallium Nitride Crystal Materials

Diamond Wire Rapid Cutting Technology for Silicon Carbide & …

The company has successfully developed a diamond wire rapid cutting process for silicon carbide (SiC) and gallium nitride (GaN) crystal materials.
Special R&D & Experimental Line for Cleaning Equipment

Special R&D & Experimental Line for Cleaning Equipment

Our company has built a special R&D and experimental line for cleaning equipment. This platform is a professional innovation carrier developed for the R&D and production requirements of cleaning equipment. It deeply integrates three core capabilities: process processing, precision measurement, and performance verification. It enables full-process technical verification and data traceability of cleaning equipment from technical pre-research to product finalization, providing critical support for the technological iteration and upgrading of equipment, optimization of performance parameters, and adaptation verification of core consumables.
APPLICATION FIELD

APPLICATION

Information and Communication

This is the core field, encompassing all devices that process and transmit information, such as computers, mobile phones, data centers, and communication networks.

Automobiles and Transportation

Covering electrification (power control), intelligence (autonomous driving chips), and connectivity (vehicle-to-everything), it is one of the fastest-growing fields.

Industry and Energy

Driving industrial automation, robotics, smart grids, and renewable energy systems demands high reliability and high performance.

Medical and Health

Used in high-end medical imaging equipment, vital signs monitoring, and portable diagnostic and therapeutic instruments, it is related to life and health.

Internet of Things and Artificial Intelligence

Representing the future direction, it provides underlying hardware support for cutting-edge technologies such as massive smart devices, AI computing power explosion, and the metaverse.

BUSINESS QUALIFICATION

QUALIFICATION

A double-sided brushing device for wafer processing
A Precision Wafer Cleaning Tool
Composite substrate, preparation method thereof, and epitaxial wafer
Automatic Sapphire Wafer Clamping Device
Tuosi Wax Mounting Machine Parameter Control System Software V1.0
Tuosi Equipment Parameter Control System Software V1.0
Tuosi Integrated Machine Parameter Control Software V1.0
Tuosi Brush Machine Parameter Control Software V1.0
Tuosi Unloading Machine Parameter Control Software V1.0
Tuosi Ceramic Disk Cleaning Machine Parameter Control Software V1.0
Yangfan Silicon Carbide Wafer Grinding Parameter Control Software V1.0
Yangfan Wafer Loading and Unloading Control Software V1.0
Yangfan Silicon Carbide Wafer Inspection and Sorting Control Software V1.0
High-tech Enterprise Certificate
Private Science and Technology Enterprise of Jiangsu Province
Jiangsu Province Star-Rated Cloud-Based Enterprise
The Second Member Unit
Advanced Collective for Work Safety
Suzhou Gazelle Enterprise 2023
Certification Certificate of Quality Management System
Environmental Management System Certification Certificate
Certification Certificate of Occupational Health and Safety Management System
Certification Certificate of Intellectual Property Management System
NEWS CENTER

NEWS